Product Introduction

Aiming at the detection needs of MiniLED wafer appearance defects, we design a special microscopic optical inspection system and defect intelligent detection AI classification algorithm, combined with a high-precision and high-speed marble mobile platform, to intelligently determine all kinds of defects and extract the classification, which effectively solves the pain point of quality control of MiniLED wafers in the manufacturing process.

Product Features

1. Support 4 inch / 6 inch / 8 inch wafer inspection, microscope optical system support 2X / 5X / 10X / 20X magnification automatic selection, bright field detection, dark field detection imaging, detection efficiency: 60WPH (6 inch);
2. Mainly detect burst point, double crystal, scratches, pressure wound, Sio2 off/ITO off, thin back plating, missing, Finger defects (disconnection, missing, bending, scratches), small green light, DBR, electrode contamination, RIE, electrode missing, chipped edges, chipped corners, light-emitting zone contamination, multi-gold, light-emitting area defects, black dots, cut bias, no needle marks and other defects;
3. Based on self-developed AI defect automatic detection and classification algorithms, output defect categories, coordinates, dimensions, and generate defect Map (support TSK, TEL, PT301).