Product Introduction

The Zeus HS8500 provides a dedicated inspection and metrology solution for dicing-related processes, effectively addressing new dicing technologies such as invisible and plasma dicing where sidewall cracks are a fatal defect, saving unnecessarily high costs throughout the manufacturing chain. Built-in, self-developed, multi-stage software accurately aligns each chip with its reference to ensure reliable inspection of diced, stretched, and rebuilt wafers, covering a wide range of wafer sizes and types as well as fast setups for demanding, high-volume manufacturing environments.

Product Features

1. Specialized chip detection algorithm ensures chip integrity.
2. Real-time chip alignment, simultaneous detection of the effective area of the chip and the street
3. Solve the new cutting technology such as stealth and plasma cutting sidewall cracks are fatal defects
4. Detect sub-micron fracture defects
5. Provide a variety of processing configurations, covering a variety of wafer sizes and types as well as rapid setup